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Female Type
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7120 Female B Type
FEATURE:
Insulator Material: PBT UL94V-0
Contact Material: Brass
Board-Lock (Optional): 100μ" Tin Plating Min.
Plating: Selective Gold Plating On Contact Area
100μ" Tin Plating On Solder Area
50μ" Nickel Min. Underplating
SPECIFICATION:
Current Rating: 20℃ 2A, 70℃ 1A, 100℃ 0.5A
Contact Resistance: 30 Milliohms Max. at DC 100mA
Insulation Resistance: 1000 Megaohms Min. At DC500V
Dielectric Voltage: AC 1000V For 1 Minute
Operation Voltage: 250VAC
Operation Temperature: -55℃ to +125℃ -
7120 Female HB Type
FEATURE:
Insulator Material: PBT UL94V-0
Contact Material: Brass
Board-Lock (Optional): 100μ" Tin Plating Min.
Plating: Selective Gold Plating On Contact Area
100μ" Tin Plating On Solder Area
50μ" Nickel Min. Underplating
SPECIFICATION:
Current Rating: 20℃ 2A, 70℃ 1A, 100℃ 0.5A
Contact Resistance: 30 Milliohms Max. at DC 100mA
Insulation Resistance: 1000 Megaohms Min. At DC500V
Dielectric Voltage: AC 1000V For 1 Minute
Operation Voltage: 250VAC
Operation Temperature: -55℃ to +125℃ -
7130 Female C Type
FEATURE:
Insulator Material: PBT UL94V-0
Contact Material: Brass
Board-Lock (Optional): 100μ" Tin Plating Min.
Plating: Selective Gold Plating On Contact Area
100μ" Tin Plating On Solder Area
50μ" Nickel Min. Underplating
SPECIFICATION:
Current Rating: 20℃ 2A, 70℃ 1A, 100℃ 0.5A
Contact Resistance: 30 Milliohms Max. at DC 100mA
Insulation Resistance: 1000 Megaohms Min. At DC500V
Dielectric Voltage: AC 1000V For 1 Minute
Operation Voltage: 250VAC
Operation Temperature: -55℃ to +125℃ -
7130 Female HC Type
FEATURE:
Insulator Material: PBT UL94V-0
Contact Material: Brass
Board-Lock (Optional): 100μ" Tin Plating Min.
Plating: Selective Gold Plating On Contact Area
100μ" Tin Plating On Solder Area
50μ" Nickel Min. Underplating
SPECIFICATION:
Current Rating: 20℃ 2A, 70℃ 1A, 100℃ 0.5A
Contact Resistance: 30 Milliohms Max. at DC 100mA
Insulation Resistance: 1000 Megaohms Min. At DC500V
Dielectric Voltage: AC 1000V For 1 Minute
Operation Voltage: 250VAC
Operation Temperature: -55℃ to +125℃ -
7520 Female Q Type
FEATURE:
Insulator Material: PBT UL94V-0
Contact Material: Brass
Board-Lock (Optional): 100μ" Tin Plating Min.
Plating: Selective Gold Plating On Contact Area
100μ" Tin Plating On Solder Area
50μ" Nickel Min. Underplating
SPECIFICATION:
Current Rating: 20℃ 2A, 70℃ 1A, 100℃ 0.5A
Contact Resistance: 30 Milliohms Max. at DC 100mA
Insulation Resistance: 1000 Megaohms Min. At DC500V
Dielectric Voltage: AC 1000V For 1 Minute
Operation Voltage: 250VAC
Operation Temperature: -55℃ to +125℃ -
7520 Female HQ Type
FEATURE:
Insulator Material: PBT UL94V-0
Contact Material: Brass
Board-Lock (Optional): 100μ" Tin Plating Min.
Plating: Selective Gold Plating On Contact Area
100μ" Tin Plating On Solder Area
50μ" Nickel Min. Underplating
SPECIFICATION:
Current Rating: 20℃ 2A, 70℃ 1A, 100℃ 0.5A
Contact Resistance: 30 Milliohms Max. at DC 100mA
Insulation Resistance: 1000 Megaohms Min. At DC500V
Dielectric Voltage: AC 1000V For 1 Minute
Operation Voltage: 250VAC
Operation Temperature: -55℃ to +125℃ -
7530 Female R Type
FEATURE:
Insulator Material: PBT UL94V-0
Contact Material: Brass
Board-Lock (Optional): 100μ" Tin Plating Min.
Plating: Selective Gold Plating On Contact Area
100μ" Tin Plating On Solder Area
50μ" Nickel Min. Underplating
SPECIFICATION:
Current Rating: 20℃ 2A, 70℃ 1A, 100℃ 0.5A
Contact Resistance: 30 Milliohms Max. at DC 100mA
Insulation Resistance: 1000 Megaohms Min. At DC500V
Dielectric Voltage: AC 1000V For 1 Minute
Operation Voltage: 250VAC
Operation Temperature: -55℃ to +125℃ -
7530 Female HR Type
FEATURE:
Insulator Material: PBT UL94V-0
Contact Material: Brass
Board-Lock (Optional): 100μ" Tin Plating Min.
Plating: Selective Gold Plating On Contact Area
100μ" Tin Plating On Solder Area
50μ" Nickel Min. Underplating
SPECIFICATION:
Current Rating: 20℃ 2A, 70℃ 1A, 100℃ 0.5A
Contact Resistance: 30 Milliohms Max. at DC 100mA
Insulation Resistance: 1000 Megaohms Min. At DC500V
Dielectric Voltage: AC 1000V For 1 Minute
Operation Voltage: 250VAC
Operation Temperature: -55℃ to +125℃