• 1100 Series 2.54 x 5.08 mm Press-Fit Type

    DESCRIPTION:
    Pitch 2.54 mm Press-Fit Type

    FEATURE:
    Insulator Material:
        Glass-Filled PBT UL94V-0
    Contact Material:
        Phosphor Bronze
    Plating: 
        Selective Gold Plating On Contact Area 
        100μ" Tin Plating On Tail Section
        50μ" Nickel Underplating

    SPECIFICATION:
    Current Rating: 3 Amperes
    Contact Resistance: 10 Milliohme Max.
    Insulation Resistance: 5000 Megaohms Min.
    Dielectric Withstanding Voltage: 1200VAC 1rms at Sea Level Between Adjacent Contacts
    Operation Temperature: -55℃ to + 105℃

    RECOMMENDED PCB HOLE
    Drilled Hole: 1.15+0.00/-0.03 mm
    Copper Plate 0.025~0.075 mm
    Tin/Lead Plating
    Finish Hole Diameter: 1.00+0.05/-0.02 mm

    Inquiry Info. High Profile Insulator Type (.PDF) Low Profile Insulator Type (.PDF)

  • 3100 Series 3.175 x 6.35 mm Press-Fit Type

    DESCRIPTION:
    Pitch 3.175 mm Press-Fit Type

    FEATURE:
    Insulator Material:
        Glass-Filled PBT UL94V-0
    Contact Material:
        Phosphor Bronze
    Plating: 
        Selective Gold Plating On Contact Area 
        100μ" Tin Plating On Tail Section
        50μ" Nickel Underplating

    SPECIFICATION:
    Current Rating: 3 Amperes
    Contact Resistance: 20 Milliohme Max.
    Insulation Resistance: 5000 Megaohms Min.
    Voltage Rating: 800VAC 1 Minute
    Operation Temperature: -55℃ to + 105℃
    Insertion Force: 412 grams Max. Per Pair
    Withdrawal Force: 32 grams Min. Per Pair

    RECOMMENDED PCB HOLE
    Drilled Hole: 1.15+0.00/-0.03 mm
    Copper Plate 0.025~0.075 mm
    Tin/Lead Plating
    Finish Hole Diameter: 1.00+0.05/-0.02 mm

    Inquiry Info. Drawing(.PDF)

  • 4000A Series 3.96 x 5.08 mm Press-Fit Type

    DESCRIPTION:
    Pitch 3.96 mm Press-Fit Type

    FEATURE:
    Insulator Material:
        Glass-Filled PBT UL94V-0
    Contact Material:
        Phosphor Bronze
    Plating: 
        Selective Gold Plating On Contact Area 
        100μ" Tin Plating On Tail Section
        50μ" Nickel Underplating

    SPECIFICATION:
    Current Rating: 3 Amperes
    Contact Resistance: 10 Milliohme Max.
    Insulation Resistance: 5000 Megaohms Min.
    Voltage Rating: 1800VAC 1 Minute
    Operation Temperature: -55℃ to + 105℃
    Daughter Board Insertion Force: 0.45 kgs Max. Per Pair
    Daughter Board Withdrawal Force: 0.028 kgs Min. Per Pair
    Contact Tail Insertion Into Hole: 40 lbs Max.
    Contact Tail Retention In Hole: 10 lbs Min.

    RECOMMENDED PCB HOLE
    Drilled Hole: 1.15±0.03mm
    Copper Plate 0.025 mm Min. Thickness
    Tin/Lead Plating
    Finish Hole Diameter: 1.02+0.08 mm

    Inquiry Info. Drawing(.PDF)

Total of 3 results